Electroless plating of alloys and their characterization
The development of metal deposition processes based on electroless metal, alloy and composite coatings on various surfaces has witnessed a surge in interest among researchers, with many recent applications made possible from many excellent properties.
Ni-Cu alloy electroless plating is one of those methods. This increases the corrosion resistance very well.
In this project electroless plating of Ni-Cu-P ternary alloy is successfully deposited on Ti plate. Electroless plating is done in basic medium with the help of Sodium hypo phosphite as a common reducing agent for Ni and Cu.
Prepared sample has been tested with XRD analysis which positively shows the presence of Ni-Cu alloy.